These new materials are typically designed to exhibit specific mechanical or electrical properties, and an emerging example are piezo-electric materials. The unique and in many cases tunable properties make it well suited for both sensing and actuating applications. Processing piezo materials is adding a complexity compared to the traditionally used silicon-based materials. Especially, the material composition and properties of commonly used piezo materials such as pzt (lead zirconate titanate) or scandium doped aluminum nitride are introducing major challenges for volume essay manufacturing. This presentation will discuss the nature of these challenges and the various paths to address them. Biography: Peter meijer is heading the european Technology Organization at Lam Research, aiming to bridge the gap from device r d to volume manufacturing enabled through Lams leading edge technology solutions. In recent years, europe has been driving new developments for iot and specifically sensor manufacturing, often addressed through mems technologies.
With his deep technical expertise and knowledge of the industrial landscape, romain performs costing analyses of mems devices, integrated circuits, and advanced packaging. He has significant experience in the modeling of the manufacturing costs of electronics components as well. Romain holds a bachelors degree in Electrical Engineering from Heriot-Watt University of Edinburgh, Scotland and a master's degree in Microelectronics from the University of Nantes, France. Manufacturing Challenges paperless for Emerging mems technologies. Peter meijer, Phd, european Technology manager, lam Research. Mems markets and applications are expanding rapidly, with new devices being introduced at an accelerated rate. Market drivers are typically device accuracy, power consumption, as well as new and enabling features. Common development strategies to address these trends across technologies are progressive miniaturization for the traditionally silicon-based devices, and also the introduction of new materials into the device structure.
Sensors are now small enough, reliable enough, and accurate enough to be included in a pocket-sized device. Moreover, battery limitation is pushing the industry towards more optimization, even on the hardware side, through either packaging innovation or new designs with lower power consumption. Wlp or sip are key enablers for heterogeneous integration in segment such as mems and sensors requiring ultra-thin profile and small footprint. Also, wlp is a turning point for cost reduction, performance boost and functional integration. Based on pictures extracted from physical analyses of several sensors and modules from the leading players, this presentation will highlight the latest trends and evolution in terms of manufacturing processes and package integration, with a focus linked to miniaturization and cost reduction. Biography: Romain Fraux is the Chief Technology Officer of System Plus Consulting, specialized in the reverse costing analysis of electronics, from semiconductor devices to electronic systems. Supporting industrial companies in their development, romain and his team are offering a complete range of services, costing tools, and reports. They deliver in-depth production cost studies and estimate objective selling price of a product, all based on a detailed physical analysis of each component in System Plus Consulting laboratory.
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In this talk, we will provide an overview of the existing state-of-the-art in low power gas sensors and describe their manufacturing techniques as well as drawbacks associated with planner these technologies, especially when considering integration with low power electronics. We will also describe the recent advances in chemical sensitive field effect transistors (cs-fets) and how this technology can effectively bridge a technological gap that is currently present with traditional mems and electrochemical gas sensors. Compared to existing gas sensor technologies, silicon-based cs-fets are manufactured using conventional cmos processing techniques, offer unprecedented advantages in terms of cost, sensitivity, selectivity, and highly scalable production capability for broad area deployment. Finally, we will provide specific use case examples of cs-fet technology and highlight new and emerging applications. Hossain Fahad is currently a post-doctoral researcher sigma at uc berkeley at the berkeley sensor and Actuator Center (bsac where he leads the research and development of silicon based chemical sensitive field effect transistor (cs-fet) together with Professor Ali javey, eecs distinguished professor at uc berkeley. At Berkeley, fahads work on cs-fets has been bestowed with four industry-nominated best research awards and was also nominated as a nsf breakthrough work in 2016. In 2017, he co-founded Serinus Labs, Inc., which is aimed at rapid commercialization of the cs-fet sensor technology.
Fahad received his PhD in Electrical Engineering from kaust in 2014. His expertise is in device physics, advanced cmos technology and processing. He has published more than 20 papers in top scientific journals and conference proceedings. Mems manufacturing Processes and Packaging: have the limits been reached? Romain Fraux, cto, system Plus Consulting, today, the mems industry has acquired from the smartphone market a strong experience in inertial sensors, microphones, and environmental sensors. Based on this experience, mems players have pushed the boundaries of performance and size.
The growth, especially in the last several years, in automotive, communications, and mobile technologies (including iot) has led to an unexpected demand for these products and, consequently, to an unprecedented surge of 200mm fab capacity. Until recently, it was possible for a 200mm fab to purchase almost any tool from multiple sources (OEMs, third party, brokers) at a compelling price. A shortage of used 200mm tools over the last year has led to steep price increases, if there is a tool available at all. Because of this trend, these tools now need to be built new by oems at a premium price. These developments have created a major constraint to the expanding capacity projected for MtM products. This talk will focus on the challenges facing this expanding 200mm/150mm MtM market.
Biography: Simon Binns is the Product Line manager for metal deposition products with the Equipment Product Group (EPG) of Applied Global Services (AGS) division of Applied Materials, Inc. Since 2010 he has been responsible for managing the 200mm pvd and mcvd equipment product portfolio to ensure alignment of Applieds capability with customer requirements. He brings over 25 years of pvd, cvd, etch, htf, cmp and Ion Implant product knowledge and experience to ags having previously served as Business development Manager for the ion Implant division in North America and Japan, and Regional Sales Manager for Northern Europe while. Simon holds a bsc in Mechanical and Production Engineering from the University of Birmingham, uk and is a former member of the city guilds of London Institute. Prior to working in the semiconductor industry, simon worked as an equipment engineer on Ion Implant, pvd and evaporation systems at the research development center of Lucas Industries, a uk based component supplier to the automotive and aerospace industry. Gas Sensors: An overview of Fabrication Techniques, device comparisons, and Emerging Trends. Hossain Fahad, PhD, post-Doctoral Researcher, berkeley sensor and Actuator Center (bsac). There is an increasing demand for mass producible, ultra-low power gas sensors for a wide variety of industrial and consumer applications.
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He works to capture and anticipate specific industry requirements, develop use cases, lead agile development of initial solutions with early shakespeare adopters, rapidly replicate and scale early successes into mature solutions, productize industry specific assets, and partner with system integrators and isvs for differentiation and scale. He has managed global software development and consulting project teams. He was instrumental in developing ibm supply Chain Management practice winning some of the largest global supply chain solution implementations in electronics industries. Before ibm he managed supply chain consulting projects at Philips Center for Manufacturing Technology. He is a member of ibm industry Academy. Mems supply Chain Challenges Facing the 200mm/150mm More than moore Equipment Market. Simon Binns, product Line manager, applied Materials, devices and applications which do not follow moores law are increasing in importance in todays semiconductor product landscape. Defined as More than moore (MtM this category includes a variety of sensors and mems devices. These components are made primarily in leq;200mm fabs and utilized in a wide variety of end-user applications ranging from smartphones to commercial drones.
business functions, internally as well as with external clients. Based on this work, we have identified a set of use cases for blockchain based solutions that all mems, semiconductors, and electronics companies should consider and that we are currently deploying. Key use cases cover provenance (the tracking of components and products origination across the supply chain supply chain visibility and procurement, and supplier information sharing, what we are calling know your party. With blockchain we also see an opportunity to solve industry-wide challenges by bringing together key leaders in a consortium organization focused on increasing trust and eliminating inefficiencies across the supply chain. This talk will start with an introduction to blockchain technology and how it applies to business operations, and then dive into specific industry applications, including tangible examples of implemented solutions. Biography: Christophe begue has twenty years of experience in business transformation, solution selling, and in the development of vertical solutions for electronics, high-tech, and manufacturing Industries. He has proven expertise in creating and scaling vertical solutions for specific industries on top of emerging horizontal technologies such as ai, machine learning, big data, analytics, iot, cloud computing, blockchain, and others.
Mems sensors are key components for a wide range of consumer, medical, industrial, and automotive applications and integration on fhe will be needed for multi-sensing applications such as body wearable navigation, environmental sensing, as well a human monitoring for fitness and medical use. By their nature, mems devices are not well suited for thinning and most designs do not allow flexing or bending. In this presentation, possible fhe integration options will be shown along with technology gaps for mems integration. Biography: Wilfried bair is responsible for device integration and system level hardware projects for NextFlex as the vice President of Engineering. Prior to joining NextFlex, wilfried was vp of Business development for Tango systems where he developed strategic partnerships and led them to enter the two fastest growing semiconductor packaging market segments, establishing them as a market leader. Previously, as vp of Strategic Business development for suss microtec ag, wilfried provided leadership to business units, identifying disruptive technology gaps, new needed marketing opportunities and acquisition targets. Other positions held at suss were gm, north American Operations, and division Manager of Wafer Bonders. Wilfrieds technical expertise spans leading edge packaging processes, next generation solar, and energy storage, semiconductor equipment and process, as well as device expertise for automotive, consumer, and medical applications. Wilfried holds advanced degrees in Manufacturing and Production Planning Systems, Organizational development, and International Marketing from the University of Linz in Austria.
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Speakers and Presentation Topics, technology Showcase Presenters, innovation Showcase Presenters. Past Speakers, call for Speakers, flexible hybrid Electronics and mems integration: Applications, Challenges, Approaches, and Technology gaps. Wilfried bair, vice President of Engineering, nextFlex. Flexible hybrid electronics (FHE) are a novel and supply chain disrupting approach to electronic systems. In fhe applications, a thin plastic film replaces the rigid printed circuit board where the fhe board is encapsulated to create the overall device. Being bendable and conformal in combination with light weight, fhe enables new ways of deploying electronic devices. Fhe as peel and stick electronics use additive manufacturing and 3D printing for electrical interconnects. One of the primary applications of fhe devices is their use as a sensor platform that is easy to deploy. Both printed sensors as well as cmos oliver based sensors have been demonstrated on fhe platforms.